• DocumentCode
    2909607
  • Title

    Improvement of Lamb waves sensors temperature sensitivity compensation

  • Author

    Jia, H. ; Duhamel, R. ; Manceau, J.F. ; de Labachelerie, M. ; Bastien, F.

  • Author_Institution
    Lab. de Phys. et de Metrol. des Oscillateurs, Univ. de Franche-Comte, Besancon, France
  • Volume
    1
  • fYear
    2003
  • fDate
    5-8 Oct. 2003
  • Firstpage
    154
  • Abstract
    Anti-symmetrical Lamb wave mode A0 present a large sensitivity to mass loading and can be used in contact with a liquid with a small attenuation. It can be, at least, expected a sensitivity 10 times greater than for an AT quartz cut using bulk waves. Nevertheless, for a practical use, the main problem is the temperature sensitivity of this sensor. A first attempt is based on a compensation of stress produced by a differential thermal dilatation. We obtain a important variation of the temperature sensitivity. Nevertheless, the results showed a poor repeatability. Then, a completely different method has been developed. On the same membrane two different waves with perpendicular propagating direction are produced. Experimentally, it has been shown that the temperature sensitivity is rather different according to the propagation direction but the mass sensitivity is almost the same. With the frequency variation, it is possible to take into account the temperature influence. In the present case, with a non-optimized device the reduction of the temperature sensitivity can be about a factor ten.
  • Keywords
    acoustic wave propagation; surface acoustic wave sensors; AT quartz; Lamb waves sensors; acoustic wave propagation; antisymmetrical Lamb wave mode; bulk waves; differential thermal dilatation; mass loading; repeatability; stress compensation; temperature sensitivity compensation; Acoustic propagation; Acoustic waves; Attenuation; Fluctuations; Frequency; Silicon; Sputter etching; Temperature sensors; Thermal stresses; Water;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics, 2003 IEEE Symposium on
  • Print_ISBN
    0-7803-7922-5
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2003.1293377
  • Filename
    1293377