Development and Qualification of the Hypertronics Stackable Connector for RBSP mission

Author

Ling, Sharon ; Wallis, Bob ; Matlin, Dan ; Kusnierkiewicz, David

Author_Institution

Appl. Phys. Lab., Johns Hopkins Univ., Laurel, MD, USA

fYear

2011

fDate

5-12 March 2011

Firstpage

1

Lastpage

15

Abstract

The Radiation Belt Storm Probes (RBSP) program office has taken the initiative of developing a solderable and stackable connector as a drop-in replacement of the Johns Hopkins University Applied Physics Laboratory (JHU/APL) heritage AirBorn press-fit connector design, in response to NASA EEE-INST-002 Addendum (released in May 2008) prohibiting the usage of the compliant or `press fit´ terminations, as well as the flat bifurcated `tuning fork´ contact designs. JHU/APL subcontracted Hypertronics to design and manufacture the custom connector. The manufacturing process development and a comprehensive qualification testing were conducted at JHU/APL.

Keywords

aerospace testing; electric connectors; reliability; space vehicle electronics; transceivers; HSC connector design; RBSP mission; RBSP transceiver configuration; environmental stress screening; flight connectors; hypertronics stackable connector; radiation belt storm probe program office; reliability; space missions; test-as-you-fly principles; verification test; Gold; Pins; Prototypes; Qualifications; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Aerospace Conference, 2011 IEEE

Conference_Location

Big Sky, MT

ISSN

1095-323X

Print_ISBN

978-1-4244-7350-2

Type

conf

DOI

10.1109/AERO.2011.5747468

Filename

5747468