Title :
BIST Design for CCD based Digital Imaging System
Author :
Jin, B. ; Park, N. ; Demidenko, Serge N. ; Choi, M. ; Lombardi, F.
Author_Institution :
Oklahoma State Univ., Stillwater
Abstract :
This paper presents a BIST design for CCD-based digital imaging system. Pixels on a CCD are not free from defective or faulty pixels due to numerous causes such as imperfect fabrication, excessive exposure to light, radiation, sensing element aging, and excessive mechanical shock, to mention a few. Today´s high demand for high-resolution CCDs is dictating defect/fault-tolerance in such devices. Especially, traditional on-device BIST cannot be readily employed on the imaging devices such as CCD due to the unique requirement that no pixel can be utilized to repair or bypass a defect on any other pixels. Therefore, the BIST technique designed and simulated in this paper is a technique to test and repair the defects on pixels off the device, referred to as off-device tolerance. The basic idea was proposed in our previous work in [2] where the off-device defect/fault tolerance was investigated and a soft-test/repair technique was theoretically proposed in order to demonstrate the efficiency and effectiveness in terms of reliability, referred to as virtual yield. A Verilog-based design and simulation is provided to demonstrate the validity of the off-device soft-test/repair in terms of reliability (or virtual yield) enhancement and performance.
Keywords :
CCD image sensors; built-in self test; fault tolerance; hardware description languages; image resolution; BIST design; CCD based digital imaging system; Verilog-based design; defect/fault-tolerance; faulty pixels; off-device tolerance; reliability terms; soft-test/repair technique; Aging; Built-in self-test; Charge coupled devices; Digital images; Electric shock; Fabrication; Fault tolerance; High-resolution imaging; Pixel; Testing; BIST; CCD (Charge Coupled Device); defect/fault tolerance; soft-test/repair;
Conference_Titel :
Instrumentation and Measurement Technology Conference Proceedings, 2007. IMTC 2007. IEEE
Conference_Location :
Warsaw
Print_ISBN :
1-4244-0588-2
DOI :
10.1109/IMTC.2007.379347