DocumentCode
2911316
Title
Curved micromachined ultrasonic transducers
Author
Wong, K.A. ; Panda, S. ; Ladabaum, I.
Author_Institution
Sensant Corp., San Leandro, CA, USA
Volume
1
fYear
2003
fDate
5-8 Oct. 2003
Firstpage
572
Abstract
Capacitive micromachined ultrasonic transducers (cMUTs) have recently emerged as an alternative to traditional piezoelectric ultrasonic transducers. They have demonstrated competitive image quality, increased bandwidth and the potential for integrated on-chip electronics. For a variety of reasons, the cMUT fabrication process has limited initial cMUT array prototypes to high frequency, flat linear or phased array designs. However, Sensant has developed a straightforward method for the manufacture of curvilinear cMUT probes. This paper outlines the modeling and cMUT design strategies, describes relevant process steps, and details the manufacturing challenges associated with the curving and packaging of a cMUT. The paper concludes with measured results, including time and frequency domain impulse response plots and phantom and in vivo images from a fully packaged cMUT array with a center frequency of 4 MHz and a radius of curvature of 40 mm, parameters typical of an abdominal imaging probe.
Keywords
capacitive sensors; electronics packaging; phantoms; piezoelectric transducers; ultrasonic transducer arrays; 4 MHz; 40 mm; abdominal imaging probe; capacitive micromachined ultrasonic transducers; curving; frequency domain impulse response plots; image quality; integrated on-chip electronics; packaging; phantom; piezoelectric ultrasonic transducers; time domain impulse response; vivo images; Bandwidth; Fabrication; Frequency; Image quality; Manufacturing; Packaging; Phased arrays; Probes; Prototypes; Ultrasonic transducers;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN
0-7803-7922-5
Type
conf
DOI
10.1109/ULTSYM.2003.1293468
Filename
1293468
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