• DocumentCode
    2911466
  • Title

    Three Evaluation Method of Modular Products

  • Author

    Shan, Quan ; Chen, Yan

  • Author_Institution
    Autom. Eng. Dept., Northeastern Univ. at Qinhuangdao, Qinhuangdao, China
  • Volume
    3
  • fYear
    2009
  • fDate
    21-22 Nov. 2009
  • Firstpage
    91
  • Lastpage
    94
  • Abstract
    Modular product evaluation is one of key technologies in modular design. Three kinds of evaluation methods, which based on three modular design styles, were proposed in this paper. These methods integrated customer satisfaction index (CSI), product customization index (PCI) or modularity degree index (MDI). Then several modularization customized products can be evaluated. Some customer satisfaction factors were discussed. The CSI was gained via separately counting the price and delivery time factors from the other factors. PCI, which was the total customization cost and its proportion, was counted, moreover, the customization cost was divided into design customization cost, manufacture customization cost and assembly customization cost, respectively. The MDI was counted with product design structure matrix (DSM). Finally, an example was presented to show the feasibility of the proposed approaches.
  • Keywords
    customer satisfaction; product customisation; product design; assembly customization cost; customer satisfaction factors; design customization cost; evaluation method; integrated customer satisfaction index; manufacture customization cost; modular design style; modular product evaluation; modularity degree index; product customization index; product design structure matrix; Assembly; Costs; Customer satisfaction; Design automation; Design engineering; Information technology; Mathematics; Product customization; Product design; Time factors; modular design; product design; products evaluation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent Information Technology Application, 2009. IITA 2009. Third International Symposium on
  • Conference_Location
    Nanchang
  • Print_ISBN
    978-0-7695-3859-4
  • Type

    conf

  • DOI
    10.1109/IITA.2009.194
  • Filename
    5369085