DocumentCode :
2912624
Title :
Improvements in the temperature stability of an IDT/ZnO/fused-quartz thin film SAW device with ZnO over-layer
Author :
Tomar, Monika ; Gupta, Vinay ; Sreenivas, K.
Author_Institution :
Dept. of Phys. & Astrophys., Delhi Univ., India
Volume :
1
fYear :
2003
fDate :
5-8 Oct. 2003
Firstpage :
901
Abstract :
Zinc oxide thin film SAW filters in the frequency range (38 to 64 MHz) have been fabricated on a fused quartz substrate. SAW propagation characteristics including electromechanical coupling coefficient (K2), SAW phase velocity (ν), insertion loss, and temperature coefficient of delay (TCD) have been measured. The measured SAW velocity and the negative TCD are in agreement with theoretical calculations, but a significant deviation is observed in the measured coupling coefficient values. Temperature stability is achieved using a ZnO over-layer. Changes in SAW and TCD characteristics of the modified ZnO/TDT/ZnO/fused quartz structure have been investigated as a function of ZnO over-layer thickness. A 5.4 μm thick ZnO over-layer is found to reduce the negative TCD of an IDT/ZnO/fused quartz layered structure to almost zero (-3 ppm/°C) and a coupling coefficient, K2=1.1% and insertion loss, IL=27 dB were measured.
Keywords :
II-VI semiconductors; acoustic wave propagation; interdigital transducers; piezoelectric semiconductors; piezoelectric thin films; quartz; semiconductor thin films; surface acoustic wave filters; surface acoustic wave transducers; thermal stability; zinc compounds; 27 dB; 38 to 64 MHz; 5.4 micron; IDT-ZnO fused quartz thin film SAW device; SAW phase velocity; SAW propagation; Zinc oxide thin film SAW filters; ZnO; ZnO overlayer; delay; electromechanical coupling coefficient; insertion loss; interdigital transducer; surface acoustic waves; temperature coefficient; temperature stability; Insertion loss; Loss measurement; Stability; Surface acoustic wave devices; Surface acoustic waves; Temperature; Thin film devices; Transistors; Velocity measurement; Zinc oxide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN :
0-7803-7922-5
Type :
conf
DOI :
10.1109/ULTSYM.2003.1293545
Filename :
1293545
Link To Document :
بازگشت