DocumentCode
2912649
Title
An analysis of the cathode thermal conductivity affecting on stability vacuum arc
Author
Mungkung, N. ; Arunrungrusmi, S. ; Yuji, T.
Author_Institution
King Mongkut´´s Univ. of Technol. Thonburi, Bangkok, Thailand
fYear
2010
fDate
Aug. 30 2010-Sept. 3 2010
Firstpage
479
Lastpage
482
Abstract
This study described the physical mechanism of the thermal conductivity effect on the instability phenomena using the cathode spot model. An analysis of stable arc current is performed by changing thermal conductivity of copper by compound material. It was found that the minimum stability arc is inversely proportion to the thermal conductivity. The thermal conductivity is reduced to increase stable arc current with reducing reversed electron from plasma region. The thermal conductivity is reduced with increasing the stable arc current region. Consequently, the cathode temperature is decreased. It can be concluded that the electron current is reduced by lower cathode temperature. This analysis results revealed that percent weight had inverse variation with thermal conductivity and flow heating alloy. The research results revealed that degree of ionization of copper had inverse variation with arc current. The debye length of copper had direct variation with arc current.
Keywords
cathodes; thermal conductivity; vacuum arcs; cathode spot model; cathode thermal conductivity; copper ionization; debye length; flow heating alloy; stability vacuum arc; Anodes; Conductivity measurement; Plasma measurements; Plasma temperature; Temperature measurement; Vacuum arcs;
fLanguage
English
Publisher
ieee
Conference_Titel
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2010 24th International Symposium on
Conference_Location
Braunschweig
ISSN
1093-2941
Print_ISBN
978-1-4244-8367-9
Electronic_ISBN
1093-2941
Type
conf
DOI
10.1109/DEIV.2010.5625761
Filename
5625761
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