Title :
Interdiffusion between Cu and Sn-rich solder: dominant diffusion species
Author :
Kim, Si-Jung ; Bae, Kyoo-Sik
Author_Institution :
Dept. of Electron. Mater. Eng., Suwon Univ., South Korea
Abstract :
Extensive microstructural and kinetic studies on the formation and growth of the intermetallics of Sn-rich solder/Cu couples have been reported. However, experimental data on the dominant diffusing species are limited and in conflict. The dominant diffusing species for the soldering and aging of Sn-3.5Ag alloy/Cu couples were investigated by using an unsoldered or Cr-evaporated surface as a reference line. After soldering, the Sn-rich alloy on top of the scallop-shaped Cu6Sn5 intermetallic compound was observed below the original Cu surface. Sn was also observed to diffuse to Cu during the aging process. Therefore, Sn was suggested to be the dominant diffusing species for both soldering and aging
Keywords :
ageing; assembling; chemical interdiffusion; copper; interface structure; packaging; silver alloys; soldering; tin alloys; Cr-evaporated surface reference line; Cu; Cu surface; Cu6Sn5; Sn diffusion; Sn dominant diffusing species; Sn-Ag alloy/Cu couples; Sn-rich alloy; Sn-rich solder; Sn-rich solder/Cu couples; SnAg-Cu; aging; aging process; dominant diffusing species; dominant diffusion species; interdiffusion; intermetallic formation; intermetallic growth; kinetic study; microstructural study; scallop-shaped Cu6Sn5 intermetallic compound; soldering; unsoldered surface reference line; Aging; Copper alloys; Electronics packaging; Intermetallic; Kinetic theory; Lead; Soldering; Substrates; Temperature; Tin;
Conference_Titel :
Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd
Print_ISBN :
0-7803-6644-1
DOI :
10.1109/EPTC.2000.906353
