DocumentCode
2912775
Title
Fully sampled matrix transducer for real time 3D ultrasonic imaging
Author
Savord, Bernard ; Solomon, Rod
Author_Institution
Philips Med. Syst., Andover, MA, USA
Volume
1
fYear
2003
fDate
5-8 Oct. 2003
Firstpage
945
Abstract
A 2D array for acquiring 3D images is described. Interconnection methods are presented that connect elements of the array to integrated circuits (ICs) within the transducer. These ICs simultaneously process signals from ALL elements forming a fully sampled array. Comparisons are made with mechanical and sparse array solutions. Several signal processing options for use within the ICs are presented.
Keywords
acoustic signal processing; integrated circuit interconnections; ultrasonic imaging; ultrasonic transducer arrays; 3D ultrasonic imaging; ICs; integrated circuits; interconnection methods; sampled matrix transducer; signal processing; Acoustic arrays; Application specific integrated circuits; Conductors; Etching; Integrated circuit interconnections; Magnetic heads; Piezoelectric transducers; Ultrasonic imaging; Ultrasonic transducers; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN
0-7803-7922-5
Type
conf
DOI
10.1109/ULTSYM.2003.1293556
Filename
1293556
Link To Document