DocumentCode :
2912916
Title :
Thermal deformation measurement of electronic package using advanced moire methods
Author :
Huimin, Xie ; Boay, Chai Gin ; Asundi, A. ; Yu, Jin ; Yunguang, Lu ; Ngoi, Bryan K A ; Zhaowei, Zhong
Author_Institution :
Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore
fYear :
2000
fDate :
2000
Firstpage :
163
Lastpage :
168
Abstract :
In this paper, the laser moire interferometry method, the electron beam moire method, the atomic force microscope (AFM) scanning moire method, and the scanning electronic microscope (SEM) scanning moire method are used to measure the thermal deformation of electronic packages. The measurement principle and the adaptability of these methods are discussed and compared. 1200 lines/mm holographic gratings in ultra low expansion (ULE) mold plates were replicated on the cross section of the measured sections in a ball grid array (BGA) electronic package and a quad flat package (QFP). These holographic gratings were fabricated on ULE mold plates and were replicated on the measured area at 100°C and 150°C, respectively. The deformation measurement principles and experimental techniques using these moire methods are described. As an application, the deformation in the different solder joints in the BGA electronic package and in the area near the die corner of the QFP electronic package was measured using these methods. Some useful results were obtained
Keywords :
atomic force microscopy; ball grid arrays; deformation; electron beam testing; holographic gratings; integrated circuit interconnections; integrated circuit measurement; integrated circuit packaging; light interferometry; measurement by laser beam; moire fringes; particle interferometry; scanning electron microscopy; soldering; thermal stresses; 100 C; 150 C; AFM scanning moire method; BGA electronic package; QFP; QFP electronic package; SEM scanning moire method; ULE mold plates; atomic force microscope scanning moire method; ball grid array; deformation measurement principles; die corner area; electron beam moire method; electronic package; electronic packages; holographic grating replication; holographic gratings; laser moire interferometry method; measured area; measured sections; moire methods; quad flat package; scanning electronic microscope scanning moire method; solder joints; thermal deformation; thermal deformation measurement; ultra low expansion mold plates; Area measurement; Atomic force microscopy; Atomic measurements; Electronic packaging thermal management; Electronics packaging; Force measurement; Gratings; Holography; Scanning electron microscopy; Thermal force;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd
Print_ISBN :
0-7803-6644-1
Type :
conf
DOI :
10.1109/EPTC.2000.906367
Filename :
906367
Link To Document :
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