An experimental procedure to derive reliable IBIS models

One of the greater parts of PCB research and development is to manage the electromagnetic compatibility and signal integrity (EMC/SI) constraints. However, the performances of these EMC/SI tools are based on the quality of used library models: PCB interconnections and IBIS models (I/O buffer information specification). To obtain an IBIS model, three methods are possible: the component maker using the Web, SPICE conversion if the corresponding SPICE model is available, and measurements. This paper describes an experimental procedure that allows creation of reliable IBIS model version 2.1 from measurements. This procedure allows building of models using classical measurement devices, controlling all steps of the procedure and achieving the required model accuracy with regard to its application field. To check the accuracy of the developed procedure, the paper presents the characterization of a TQFP component. Through a classical SI phenomenon (reflection), comparison between measured and simulated results is performed, using the available IBIS Web model and the measured IBIS model