Title :
A new broadband transmission line model for accurate simulation of dispersive interconnects
Author :
Morsey, J. ; Coperich, K. ; Okhmatovski, V. ; Cangellaris, A.C. ; Ruehli, A.
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Abstract :
This paper presents a new method for the extraction of the frequency-dependent, per-unit-length resistance and inductance parameters of multi-conductor interconnects. The proposed extraction methodology is based on a new formulation of the magneto-quasi-static problem that allows lossy ground planes of finite thickness to be modeled rigorously. The formulation is such that the per-unit-length impedance matrix for the multi-conductor interconnect is extracted directly at a prescribed frequency. Once the matrix has been calculated over the bandwidth of interest, rational function representations of its elements are generated through a robust matrix curve-fitting process. Such a formulation enables subsequent transient analysis of interconnects through a variety of approaches, all of them compatible with general-purpose circuit simulators
Keywords :
circuit simulation; curve fitting; dispersion (wave); impedance matrix; inductance; interconnections; multiconductor transmission lines; packaging; transient analysis; transmission line theory; broadband transmission line model; dispersive interconnects; frequency-dependent per-unit-length inductance parameters; frequency-dependent per-unit-length resistance parameters; general-purpose circuit simulators; interconnects; lossy ground planes; magneto-quasi-static problem; matrix curve-fitting process; model; multi-conductor interconnect; multi-conductor interconnects; parameter extraction methodology; per-unit-length impedance matrix; rational function representations; simulation; transient analysis; Bandwidth; Curve fitting; Frequency; Impedance; Inductance; Integrated circuit interconnections; Multiconductor transmission lines; Robustness; Transmission line matrix methods; Transmission lines;
Conference_Titel :
Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd
Print_ISBN :
0-7803-6644-1
DOI :
10.1109/EPTC.2000.906398