DocumentCode :
2913596
Title :
Heating and reliability characteristics of electrically conductive adhesives using variable frequency microwave cure
Author :
Wang, Tiebing ; Fu, Ying ; Becker, Matthias ; Liu, Johan
Author_Institution :
Dept. of Production Eng., Chalmers Univ. of Technol., Molndal, Sweden
fYear :
2000
fDate :
2000
Firstpage :
373
Lastpage :
377
Abstract :
Microwaves (MW) as heating source to cure polymer and polymer based composites can significantly speed up the curing process. Electrically conductive adhesive, (ECA) however, excludes the use of MW because metal particles contained inside the ECA will cause arcing when exposed to MW. A new technique named variable frequency microwave (VFMW) has recently been developed, with which arcing caused by the presence of metal can be avoided, and thus a rapid process for curing ECA is available with use of this technique. In this paper, several kinds of electrically conductive adhesives were cured with VFMW, and the heating rates as a function of the polymer material, the percentage of metal particles in the ECAs, the effect of geometric size and shape of the metal particles, and the physical parameters of the VFMW are reported. Then, reliability testing was conducted to analyze the reliability of the conductive adhesive-joint under VFMW curing conditions
Keywords :
adhesives; arcs (electric); assembling; circuit reliability; conducting polymers; filled polymers; heat treatment; microwave heating; plastic packaging; process heating; ECA; VFMW; VFMW curing conditions; arcing; conductive adhesive-joint; curing process; electrically conductive adhesives; heating characteristics; heating rates; metal particle shape; metal particle size; metal particles; microwave heating source; polymer based composites; polymer cure; polymer material; rapid curing; reliability; reliability characteristics; reliability testing; variable frequency microwave; variable frequency microwave cure; Conducting materials; Conductive adhesives; Curing; Electromagnetic heating; Frequency; Inorganic materials; Microwave theory and techniques; Polymers; Resistance heating; Shape;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd
Print_ISBN :
0-7803-6644-1
Type :
conf
DOI :
10.1109/EPTC.2000.906403
Filename :
906403
Link To Document :
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