Three-dimensional analysis of an enhanced cooling system for electronic packaging

Author

Wong, C.W. ; Seetharamu, K.N. ; Alimuddin, Zainal ; Hassan, A.Y. ; Goh, Teck Joo

Author_Institution

Sch. of Mech. Eng., Malaysia Sci. Univ., Tronoh, Malaysia

fYear

2000

fDate

2000

Firstpage

431

Lastpage

437

Abstract

This study investigates the maximum heat flux and its corresponding superheat temperature for a straight pin fin in a boiling FC-72. Investigations are carried out numerically under atmospheric pressure by solving a three dimensional heat conduction equation in steady state. The finite element method (FEM) is used to investigate this phenomenon. The numerical results are in good agreement with available experimental results. One-dimensional analysis of boiling on a straight pin fin had been carried out. Therefore, comparison is made between the one and three-dimensional analysis results. The effect of length and diameter on the maximum heat flux (MHF) and the operational stability are also investigated

Keywords

cooling; finite element analysis; heat conduction; thermal management (packaging); thermal stability; 3D analysis; 3D heat conduction equation; atmospheric pressure; boiling 1D analysis; boiling FC-72; diameter effects; electronic packaging; enhanced cooling system; finite element method; length effects; maximum heat flux; operational stability; straight pin fin; superheat temperature; Assembly; Electronic components; Electronics cooling; Electronics packaging; Equations; Finite element methods; Mechanical engineering; Stability analysis; Tellurium; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd

Print_ISBN

0-7803-6644-1

Type

conf

DOI

10.1109/EPTC.2000.906412

Filename

906412