Title :
Elimination of lead in first level semiconductor packaging
Author_Institution :
STMicroelectronics, Agrate, Italy
Abstract :
Interconnection technology of the first and second levels of electronic packaging is based on tin-lead alloys, which provide cheap and reliable solder joints. International regulations for environmental protection are addressing the elimination of lead, and this poses a number of technical challenges. For first level packaging, six different technologies are involved. For four of them, Pb-free versions are available or close to being qualified; in two cases, however, solutions are not ready and require long development activity
Keywords :
assembling; environmental factors; integrated circuit interconnections; integrated circuit packaging; lead; legislation; soldering; Pb; Pb elimination; Pb-free technologies; cheap solder joints; development activity; electronic packaging; environmental protection; first level packaging; first level semiconductor packaging; interconnection technology; international regulations; lead elimination; packaging technologies; reliable solder joints; technical challenges; tin-lead alloys; Coatings; Consumer electronics; Electronics packaging; Europe; Glass; Lead compounds; Plastic packaging; Semiconductor device packaging; Temperature; Tin;
Conference_Titel :
Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd
Print_ISBN :
0-7803-6644-1
DOI :
10.1109/EPTC.2000.906415
