Title :
Overview and development trends in the field of MEMS packaging
Author :
Reichl, H. ; Grosser, V.
Author_Institution :
Fraunhofer-Inst. fur Zuverlassigkeit und Mikrointegration, Berlin, Germany
Abstract :
Micro Electro Mechanical Systems (MEMS) packaging is expensive and product and application specific. Single chip packages for IC´s are only for some microsystems applicable. Cost efficient MEMS packaging focuses wafer level packaging (WLP). An identical trend is observed in IC packaging. Chip size packages (CSP) are fabricated by WLP. Future microelectronic system will be fabricated by wafer level assembly of multiple components on a base chip. System on package (SOP) techniques including 3D cubic integration will be used. For MEMS packaging a Modular MEMS system integration (MOMEMS) is proposed. Cubic integration by stacking of CSP packaged MEMS modules contribute to an economic realization of low volume microsystems.
Keywords :
integrated circuit packaging; micromechanical devices; 3D cubic integration; IC package; MEMS packaging; Modular MEMS; chip size package; microelectronic system; microsystem technology; system-on-package; wafer level package; Actuators; Costs; Electronics packaging; Integrated circuit packaging; Integrated circuit technology; Microelectronics; Micromechanical devices; Packaging machines; Steel; Vibration measurement;
Conference_Titel :
Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on
Conference_Location :
Interlaken, Switzerland
Print_ISBN :
0-7803-5998-4
DOI :
10.1109/MEMSYS.2001.906464
