DocumentCode
2914321
Title
Study on Three-Dimensional Numerical Simulation of the Influence of Fin Spacing on the Power of Heat Sink and Heat Dissipation
Author
Jingfu Cao
Author_Institution
Zhengzhou Univ., Zhengzhou, China
fYear
2011
fDate
25-28 March 2011
Firstpage
1
Lastpage
4
Abstract
This paper mainly studied the heat dissipation of the heat sink placing on the level of the natural convection cooling conditions by numerical simalation.lt is found that on the conditions of the same width of the heat sink , the power of convection heat dissipation of heat sink can´t be increased by reducing spacing of fins(representing an increase of the number offins of heat sink ). By comparing the numerical simulation results of heat sink and theoretical analysis shows, there is an air stagnation zone in the heat sink of straight fins that placing on the level.The feature that there is almost no movement within the zone affected the play of natural convection of heat sink. As the narrowing of fin spacing,the area of this zone increased.There is a best numerical value of fin spacing,and there can be the maximum power of heat sink and heat dissipation under the best spacing.Over the best value, the power of heat sink and heat dissipation will be lowered because of reducing the area of fins; when under the best value, the power of heat sink and heat dissipation also will be lowered because of reducing the effective area of heat dissipation.
Keywords
convection; cooling; heat sinks; light emitting diodes; numerical analysis; fin spacing; heat dissipation; heat sink; high-power LED; natural convection cooling; numerical simulation; semiconductor manufacturing technology; semiconductor solid light; theoretical analysis; three-imensional numerical simulation; Heat sinks; Heat transfer; Light emitting diodes; Numerical simulation; Resistance heating;
fLanguage
English
Publisher
ieee
Conference_Titel
Power and Energy Engineering Conference (APPEEC), 2011 Asia-Pacific
Conference_Location
Wuhan
ISSN
2157-4839
Print_ISBN
978-1-4244-6253-7
Type
conf
DOI
10.1109/APPEEC.2011.5747704
Filename
5747704
Link To Document