• DocumentCode
    2914339
  • Title

    MEMS techniques applied to the fabrication of anti-scatter grids for X-ray imaging

  • Author

    Lehmann, V. ; Ronnebeck, S.

  • Author_Institution
    Dept. CPR ET, Infineon Technol., Munich, Germany
  • fYear
    2001
  • fDate
    25-25 Jan. 2001
  • Firstpage
    84
  • Lastpage
    85
  • Abstract
    This paper reports a promising method for the fabrication of lead collimators for X-ray radiology applications. The fabrication method is based on arrays of macropores etched into a silicon wafer using an electrochemical process. The macropores are filled with lead and the silicon substrate is removed subsequently. The macroporous silicon structure thereby acts as a sacrificial layer. The use of MEMS techniques enables us to decrease the size of the structure by one order of magnitude compared to conventional collimators, thus increasing the optical resolution of the X-ray system.
  • Keywords
    X-ray imaging; etching; micromechanical devices; optical collimators; radiology; MEMS technique; Pb; Si; X-ray imaging; X-ray radiology; anti-scatter grid; electrochemical etching; fabrication; lead collimator; macropore array; optical resolution; sacrificial layer; silicon wafer substrate; Casting; Etching; Fabrication; Lead; Micromechanical devices; Optical collimators; Optical scattering; Radiology; Silicon; X-ray imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on
  • Conference_Location
    Interlaken, Switzerland
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-5998-4
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2001.906484
  • Filename
    906484