DocumentCode
2914339
Title
MEMS techniques applied to the fabrication of anti-scatter grids for X-ray imaging
Author
Lehmann, V. ; Ronnebeck, S.
Author_Institution
Dept. CPR ET, Infineon Technol., Munich, Germany
fYear
2001
fDate
25-25 Jan. 2001
Firstpage
84
Lastpage
85
Abstract
This paper reports a promising method for the fabrication of lead collimators for X-ray radiology applications. The fabrication method is based on arrays of macropores etched into a silicon wafer using an electrochemical process. The macropores are filled with lead and the silicon substrate is removed subsequently. The macroporous silicon structure thereby acts as a sacrificial layer. The use of MEMS techniques enables us to decrease the size of the structure by one order of magnitude compared to conventional collimators, thus increasing the optical resolution of the X-ray system.
Keywords
X-ray imaging; etching; micromechanical devices; optical collimators; radiology; MEMS technique; Pb; Si; X-ray imaging; X-ray radiology; anti-scatter grid; electrochemical etching; fabrication; lead collimator; macropore array; optical resolution; sacrificial layer; silicon wafer substrate; Casting; Etching; Fabrication; Lead; Micromechanical devices; Optical collimators; Optical scattering; Radiology; Silicon; X-ray imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on
Conference_Location
Interlaken, Switzerland
ISSN
1084-6999
Print_ISBN
0-7803-5998-4
Type
conf
DOI
10.1109/MEMSYS.2001.906484
Filename
906484
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