"SAMs meet MEMS": surface modification with self-assembled monolayers for the dry-demolding of photoplastic MEMS/NEMS

Author

Kim, B.J. ; Kim, G.M. ; Liebau, M. ; Huskens, J. ; Reinhoudt, D.N. ; Brugger, Juergen

Author_Institution

MESA Res. Inst., Twente Univ., Enschede, Netherlands

fYear

2001

fDate

25-25 Jan. 2001

Firstpage

106

Lastpage

109

Abstract

In this contribution we demonstrate the use of self-assembled monolayers (SAMs) as anti-adhesion coating to assist the removal of photoplastic MEMS/NEMS with a patterned metal layer from the surface without wet chemical sacrificial layer etching, so-called ´dry-demolding´. The SAMs functionality here is to reduce the stiction between the surface and a thin evaporated metal film. The double-layer SAM/metal provides enough stability to support subsequent micromachining steps.

Keywords

micromechanical devices; monolayers; moulding; nanotechnology; plastics; self-assembly; stiction; SAM/metal double layer; anti-adhesion coating; dry demolding; evaporated metal thin film; organic self-assembled monolayer; photoplastic MEMS/NEMS; stiction; surface microfabrication; Adhesives; Chemistry; Dry etching; Fabrication; Micromechanical devices; Microstructure; Optical microscopy; Surface contamination; Surface topography; Wet etching;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on

Conference_Location

Interlaken, Switzerland

ISSN

1084-6999

Print_ISBN

0-7803-5998-4

Type

conf

DOI

10.1109/MEMSYS.2001.906490

Filename

906490