Title :
Convection-based micromachined inclinometer using SOI technology
Author :
Billat, S. ; Glosch, H. ; Kunze, M. ; Hedrich, F. ; Frech, J. ; Auber, J. ; Lang, W. ; Sandmaier, H. ; Wimmer, W.
Author_Institution :
Inst. for Micromachining & Inf. Technol., Hahn-Schickard-Gesellscaft, Villingen-Schwenningen, Germany
Abstract :
This paper presents a novel inclinometer operating with the free-convection heat transfer principle which has been developed at the HSG-IMIT for the VOGT electronic company. The use of SOI-technology permits a short technological process for the sensor fabrication and a very good mechanical stability like a high reproducibility. Using free convection properties the sensor presents a high resolution (0.007/spl deg/), a great sensitivity and baseline stability.
Keywords :
angular measurement; mechanical stability; micromachining; microsensors; natural convection; silicon-on-insulator; SOI technology; Si; free convection; heat transfer; inclinometer; mechanical stability; micromachining; reproducibility; resolution; sensitivity; sensor fabrication; Bridge circuits; Domestic safety; Fabrication; Heat transfer; Mechanical sensors; Resistance heating; Silicon; Stability; Temperature sensors; Thermal sensors;
Conference_Titel :
Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on
Conference_Location :
Interlaken, Switzerland
Print_ISBN :
0-7803-5998-4
DOI :
10.1109/MEMSYS.2001.906504
