Title :
256-pixel CMOS-integrated thermoelectric infrared sensor array
Author :
Schaufelbuchl, A. ; Munich, U. ; Menolfi, C. ; Brand, O. ; Paul, O. ; Huang, Q. ; Baltes, H.
Author_Institution :
Phys. Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland
Abstract :
This paper presents a micromachined 16/spl times/16 array of thermoelectric infrared sensors fabricated in a commercial CMOS IC process with subsequent bulk-micromachining on wafer-scale. Each pixel contains a integrated heater, which makes calibration and self-testing possible. Addressing circuity and four low-noise amplifiers are cointegrated with the array on a single chip with a size of 7.4/spl times/12 mm/sup 2/. A thermal imager based on the infrared sensor-array, operates in ambient air, without thermal stabilization or cooling. The thermoelectric sensor principle allows to measure DC radiation signals even without a radiation chopper. The temperature resolution achieved at 1 Hz framerate in 176 mK.
Keywords :
CMOS image sensors; infrared detectors; microsensors; thermoelectric devices; 1 Hz; 12 mm; 176 mK; 256-pixel CMOS-integrated thermoelectric infrared sensor array; 7.4 mm; bulk-micromachining; calibration; circuity; cooling; low-noise amplifiers; micromachined 16/spl times/16 array; self-testing; thermal stabilization; wafer-scale; Built-in self-test; CMOS image sensors; CMOS integrated circuits; CMOS process; Calibration; Infrared image sensors; Infrared sensors; Low-noise amplifiers; Sensor arrays; Thermoelectricity;
Conference_Titel :
Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on
Conference_Location :
Interlaken, Switzerland
Print_ISBN :
0-7803-5998-4
DOI :
10.1109/MEMSYS.2001.906513
