Title :
Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)
Abstract :
The following topics were dealt with: MCM-L; flip chip; testing; MCM-C and MCM-D; thermal management; design; advanced materials; CSP; RF and telecoms; interconnects; high density interconnects on flex; KGD; reliability; substrate processing; integrated passives; applications
Keywords :
multichip modules; packaging; CSP; KGD; MCM-C; MCM-D; MCM-L; RF telecoms; applications; design; flip chip; high density interconnects; high density packaging; integrated passives; interconnects; multichip modules; reliability; substrate processing; testing; thermal management;
Conference_Titel :
Multichip Modules and High Density Packaging, 1998. Proceedings. 1998 International Conference on
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-4850-8
DOI :
10.1109/ICMCM.1998.671355
