Deposition of Ti-Al-N coatings using two-channel T-Shaped magnetic filter

Vacuum arc deposited Ti-Al-N films was prepared using two-channel T-Shaped plasma filter with two plasma sources having Al and Ti cathodes operating in nitrogen atmosphere. Two separate plasma streams were completely mixed into one beam inside the plasma duct having cusp-shaped magnetic field near its output. As a result the films on a 180 mm diameter substrate have uniform composition and thickness. It was found that degree of uniformity increases along with nitrogen pressure. Film sputtering was observed if negative substrate potential was applied. Increase of output-to-substrate distance leads to deposition rate reduction and degree of uniformity gain. Aluminum to titanium ratio can be varied from 8 wt.% to 58 wt.%.