DocumentCode :
2915694
Title :
A high-performance silicon micropump for disposable drug delivery systems
Author :
Maillefer, D. ; Gamper, S. ; Frehner, B. ; Balmer, P. ; van Lintel, H. ; Renaud, P.
Author_Institution :
Dept. of Microsyst., DEBIOTECH SA, Lausanne, Switzerland
fYear :
2001
fDate :
25-25 Jan. 2001
Firstpage :
413
Lastpage :
417
Abstract :
This paper describes the design, fabrication and experimental results of a new, low cost, high-performance silicon micropump developed for a disposable drug delivery system. The pump chip demonstrates linear and accurate (/spl plusmn/5%) pumping characteristics for flow rates up to 2 ml/h with intrinsic insensitivity to external conditions. The stroke volume of 160 nl is maintained constant by the implementation of a double limiter acting on the pumping membrane. The actuator is dissociated from the pump chip. The chip is a stack of three layers, two Pyrex wafers anodically bonded to the central silicon wafer. The technology is based on the use of SOI technology, silicon DRIE and the sacrificial etch of the buried oxide in order to release the structures. The result is a small size chip, suitable for cost-effective manufacturing in high volume. The micropump chip is integrated into the industrial development of a miniature external insulin pump for diabetes care.
Keywords :
biomedical electronics; drug delivery systems; elemental semiconductors; microactuators; micropumps; patient care; silicon; silicon-on-insulator; sputter etching; DRIE; Pyrex wafers; SOI technology; Si; actuator; cost-effective manufacturing; diabetes care; disposable drug delivery systems; double limiter; external insulin pump; flow rates; intrinsic insensitivity; micropump; pumping characteristics; pumping membrane; sacrificial etch; stroke volume; Actuators; Biomembranes; Costs; Drug delivery; Etching; Fabrication; Manufacturing; Micropumps; Silicon; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on
Conference_Location :
Interlaken, Switzerland
ISSN :
1084-6999
Print_ISBN :
0-7803-5998-4
Type :
conf
DOI :
10.1109/MEMSYS.2001.906566
Filename :
906566
Link To Document :
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