• DocumentCode
    2915694
  • Title

    A high-performance silicon micropump for disposable drug delivery systems

  • Author

    Maillefer, D. ; Gamper, S. ; Frehner, B. ; Balmer, P. ; van Lintel, H. ; Renaud, P.

  • Author_Institution
    Dept. of Microsyst., DEBIOTECH SA, Lausanne, Switzerland
  • fYear
    2001
  • fDate
    25-25 Jan. 2001
  • Firstpage
    413
  • Lastpage
    417
  • Abstract
    This paper describes the design, fabrication and experimental results of a new, low cost, high-performance silicon micropump developed for a disposable drug delivery system. The pump chip demonstrates linear and accurate (/spl plusmn/5%) pumping characteristics for flow rates up to 2 ml/h with intrinsic insensitivity to external conditions. The stroke volume of 160 nl is maintained constant by the implementation of a double limiter acting on the pumping membrane. The actuator is dissociated from the pump chip. The chip is a stack of three layers, two Pyrex wafers anodically bonded to the central silicon wafer. The technology is based on the use of SOI technology, silicon DRIE and the sacrificial etch of the buried oxide in order to release the structures. The result is a small size chip, suitable for cost-effective manufacturing in high volume. The micropump chip is integrated into the industrial development of a miniature external insulin pump for diabetes care.
  • Keywords
    biomedical electronics; drug delivery systems; elemental semiconductors; microactuators; micropumps; patient care; silicon; silicon-on-insulator; sputter etching; DRIE; Pyrex wafers; SOI technology; Si; actuator; cost-effective manufacturing; diabetes care; disposable drug delivery systems; double limiter; external insulin pump; flow rates; intrinsic insensitivity; micropump; pumping characteristics; pumping membrane; sacrificial etch; stroke volume; Actuators; Biomembranes; Costs; Drug delivery; Etching; Fabrication; Manufacturing; Micropumps; Silicon; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on
  • Conference_Location
    Interlaken, Switzerland
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-5998-4
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2001.906566
  • Filename
    906566