DocumentCode :
2916202
Title :
Low-cost technology for high-density microvalve arrays using polydimethylsiloxane (PDMS)
Author :
Hosokawa, K. ; Maeda, R.
Author_Institution :
Div. of Surface & Interface Technol., AIST, Ibaraki, Japan
fYear :
2001
fDate :
25-25 Jan. 2001
Firstpage :
531
Lastpage :
534
Abstract :
In this paper, a rapid and low-cost fabrication technology for high-density microvalve arrays is presented. For proof of the concept, a pneumatically-actuated three-way microvalve system composed of three independent one-way valve units was fabricated and tested. Each valve unit has a membrane, which is actuated by external negative air pressure. Intervals between the valve units are smaller than 780 /spl mu/m. These small intervals have been realized by providing the system with a layer of microchannels to conduct the air pressure to the valve units. All the parts were made of inexpensive silicone elastomer - polydimethylsiloxane (PDMS) - and rapidly fabricated with molding and spin-coating. A newly developed technique for wafer level transfer of a PDMS membrane has been proven to be effective. Flow characteristics of the microvalve system for water are presented. The microvalve works in an on-off manner with hysteresis. No leakage has been observed in the closed state. In the open state, measured flow resistances (pressure drops) are within the range of 1.65-2.29 kPa/(/spl mu/L/min).
Keywords :
elastomers; membranes; microvalves; moulding; pneumatic control equipment; silicones; spin coating; PDMS; fabrication technology; high-density microvalve array; hysteresis; molding; multilayer microchannel system; pneumatic actuation; polydimethylsiloxane; pressure drop; silicone elastomer membrane; spin coating; wafer level transfer; water flow resistance; Biomembranes; Electrical resistance measurement; Fabrication; Fluid flow measurement; Hysteresis; Microchannel; Microvalves; System testing; Valves; Water;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2001. MEMS 2001. The 14th IEEE International Conference on
Conference_Location :
Interlaken, Switzerland
ISSN :
1084-6999
Print_ISBN :
0-7803-5998-4
Type :
conf
DOI :
10.1109/MEMSYS.2001.906596
Filename :
906596
Link To Document :
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