Title : 
Novel electrothermal bimorph actuator for large out-of-plane displacement and force
         
        
            Author : 
Wei, J. ; Duc, T. Chu ; Lau, G.K. ; Sarro, P.M.
         
        
            Author_Institution : 
Delft Univ. of Technol., Delft
         
        
        
        
        
        
            Abstract : 
This paper presents a novel concept and experimental validation of an electrothermal bimorph structure for out-of-plane actuation that exploits the polymer constraint effect. The proposed concept is capable of generating large out-of-plane displacements and forces at a low driving voltage and a low actuation temperature. A downward displacement up to 31 mum is measured at only 5 V driving voltage and 46 mW power consumption. The actuator stiffness is measured to be 75 N/m, thus the corresponding calculated out-of-plane force is 2.3 mN. The maximum actuation temperature during the measurement is 100degC (80degC change). A 25 Hz response frequency is measured by monitoring the resistance change due to the temperature variation.
         
        
            Keywords : 
elasticity; electrical resistivity; frequency measurement; microactuators; temperature measurement; MEMS devices; actuator stiffness measurement; electrothermal bimorph actuator; frequency 25 Hz; low actuation temperature; out-of-plane actuation; out-of-plane displacement; polymer constraint effect; power 46 mW; response frequency measurement; voltage 5 V; Actuators; Displacement measurement; Electrical resistance measurement; Electrothermal effects; Energy consumption; Force measurement; Low voltage; Polymers; Power measurement; Temperature measurement;
         
        
        
        
            Conference_Titel : 
Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
         
        
            Conference_Location : 
Tucson, AZ
         
        
        
            Print_ISBN : 
978-1-4244-1792-6
         
        
            Electronic_ISBN : 
1084-6999
         
        
        
            DOI : 
10.1109/MEMSYS.2008.4443589