Title :
Implantable RF-coiled chip packaging
Author :
Li, W. ; Rodger, D.C. ; Tai, Y.C.
Author_Institution :
California Inst. of Technol., Pasadena
Abstract :
In this paper, we present an embedded chip integration technology that utilizes silicon housings and flexible parylene radio frequency (RF) coils. As a demonstration of this technology, a flexible parylene RF coil has been integrated with an RF identification (RFID) chip. The coil has an inductance of 16 muH, with two layers of metal completely encapsulated in parylene-C. The functionality of the embedded chip is verified using an RFID reader module. Accelerated-lifetime soak testing has been performed in saline, and the results show that the silicon chip is well protected and the lifetime of our parylene-encapsulated RF coil at 37degC is more than 20 years.
Keywords :
coils; integrated circuit packaging; integrated circuit testing; radiofrequency identification; radiofrequency integrated circuits; RF identification chip; accelerated-lifetime soak testing; embedded chip integration technology; flexible parylene radio frequency coils; implantable RF-coiled chip packaging; parylene-C; silicon chip; silicon housings; temperature 37 C; Coils; Inductance; Life estimation; Life testing; Packaging; Performance evaluation; Protection; Radio frequency; Radiofrequency identification; Silicon;
Conference_Titel :
Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
Conference_Location :
Tucson, AZ
Print_ISBN :
978-1-4244-1792-6
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2008.4443604
