Title :
Ruggedization of MXM graphics modules
Author_Institution :
Curtiss-Wright Controls Defense Solutions, Ottawa, ON, Canada
Abstract :
MXM modules, used to package graphics processing devices for use in benign environments, have been tested for use in harsh environments typical of deployed defense and aerospace systems. Results show that specially mechanically designed MXM GP-GPU modules can survive these environments, and successfully provide the enormous processing capability offered by the latest generation of GPUs to harsh environment applications.
Keywords :
graphics processing units; MXM GP-GPU modules; MXM graphics module ruggedization; aerospace systems; defense systems; general purpose graphics processor units; graphics processing devices; Connectors; Contacts; Electric shock; Humidity; Testing; Vehicles; Vibrations;
Conference_Titel :
High Performance Extreme Computing (HPEC), 2012 IEEE Conference on
Conference_Location :
Waltham, MA
Print_ISBN :
978-1-4673-1577-7
DOI :
10.1109/HPEC.2012.6408666
