DocumentCode :
2917206
Title :
Basic study of brain injury mechanism
Author :
Saito, S. ; Kato, K. ; Yamada, T. ; Kurosawa, Y. ; Shindo, Y. ; Kubo, M. ; Takahashi, H. ; Uzuka, T. ; Fujii, Y.
Author_Institution :
Dept. of Mech. Eng. Inf., Meiji Univ., Kawasaki, Japan
fYear :
2010
fDate :
Aug. 31 2010-Sept. 4 2010
Firstpage :
528
Lastpage :
531
Abstract :
The purpose of this study is to discuss the mechanism of brain injury experimentally paying attention to the pressure changes on the surface of a brain agar phantom generated by a cavitation. In this paper, first, an experimental system for performing an simple impact experiment is presented. A simple human head model consists of a skull, cerebrospinal fluid (CSF) and brain tissue, represented by acrylic resin, water and agar, respectively. Second, we measured the pressure changes on the surface of the brain agar phantom during impact. We also observed the behavior of the simple head model using a high-speed camera. From the photographs taken by the high-speed camera, we confirmed that cavitation bubbles occurred at the contrecoup side. And the surface of the brain agar phantom at the contrecoup side was also destroyed. From these results, the destruction of the surface of the brain agar phantom at the contrecoup side, during impact is caused by pressure changes generated by the cavitation.
Keywords :
biomechanics; brain; cavitation; impact (mechanical); injuries; neurophysiology; phantoms; pressure measurement; CSF; acrylic resin; brain agar phantom; brain injury mechanism; brain surface pressure changes; brain tissue; cavitation; cerebrospinal fluid; high speed camera; high speed photographs; human head model; impact experiment; skull; water; Brain injuries; Brain modeling; Cameras; Finite element methods; Phantoms; Pressure measurement; Agar; Biomechanics; Biomedical Research; Brain; Brain Injuries; Head; Humans; Models, Biological; Photography; Pressure;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2010 Annual International Conference of the IEEE
Conference_Location :
Buenos Aires
ISSN :
1557-170X
Print_ISBN :
978-1-4244-4123-5
Type :
conf
DOI :
10.1109/IEMBS.2010.5626042
Filename :
5626042
Link To Document :
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