DocumentCode :
2917847
Title :
Study the effect of polysilicon doping on the junction depth in 65nm structure
Author :
Zurita, Z. ; Shukri, M.M. ; Rusop, M.M.
Author_Institution :
Fac. of Electr. Eng., Univ. Teknol. MARA, Shah Alam, Malaysia
fYear :
2010
fDate :
11-14 April 2010
Firstpage :
418
Lastpage :
422
Abstract :
An analysis the effect of polysilicon doping on the junction depth in the 65 nm structure was conducted in this paper. Several parameters presented in the polysilicon doping process were investigated and the TONY PLOT profile for the junction depth was developed to help understanding the polysilicon doping effect which is crucial to produce stable threshold voltage and also how some of these parameters have effect on the n++ sheet resistance. For this doping process, it was conducted using ion implantation technique with two type of impurities; phosphorus and arsenic on crystalline material. The cutline to extracting the junction depth at gate and source/drain in TONY PLOT was done for investigation in dependence of the polysilicon doping profile. All simulations were done by using SILVACO.
Keywords :
CMOS technology; Crystalline materials; Doping profiles; Fabrication; Impurities; Integrated circuit technology; Ion implantation; MOS devices; Oxidation; Threshold voltage; Polysilicon doping; arsenic; ion implantation; junction depth; phosphorus;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Devices, Systems and Applications (ICEDSA), 2010 Intl Conf on
Conference_Location :
Kuala Lumpur, Malaysia
Print_ISBN :
978-1-4244-6629-0
Type :
conf
DOI :
10.1109/ICEDSA.2010.5503026
Filename :
5503026
Link To Document :
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