• DocumentCode
    2917847
  • Title

    Study the effect of polysilicon doping on the junction depth in 65nm structure

  • Author

    Zurita, Z. ; Shukri, M.M. ; Rusop, M.M.

  • Author_Institution
    Fac. of Electr. Eng., Univ. Teknol. MARA, Shah Alam, Malaysia
  • fYear
    2010
  • fDate
    11-14 April 2010
  • Firstpage
    418
  • Lastpage
    422
  • Abstract
    An analysis the effect of polysilicon doping on the junction depth in the 65 nm structure was conducted in this paper. Several parameters presented in the polysilicon doping process were investigated and the TONY PLOT profile for the junction depth was developed to help understanding the polysilicon doping effect which is crucial to produce stable threshold voltage and also how some of these parameters have effect on the n++ sheet resistance. For this doping process, it was conducted using ion implantation technique with two type of impurities; phosphorus and arsenic on crystalline material. The cutline to extracting the junction depth at gate and source/drain in TONY PLOT was done for investigation in dependence of the polysilicon doping profile. All simulations were done by using SILVACO.
  • Keywords
    CMOS technology; Crystalline materials; Doping profiles; Fabrication; Impurities; Integrated circuit technology; Ion implantation; MOS devices; Oxidation; Threshold voltage; Polysilicon doping; arsenic; ion implantation; junction depth; phosphorus;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Devices, Systems and Applications (ICEDSA), 2010 Intl Conf on
  • Conference_Location
    Kuala Lumpur, Malaysia
  • Print_ISBN
    978-1-4244-6629-0
  • Type

    conf

  • DOI
    10.1109/ICEDSA.2010.5503026
  • Filename
    5503026