Title :
Micromachined LCP for packaging MEMS sensors
Author :
Dean, Robert ; Pack, Jeremiah ; Sanders, Nicole ; Reiner, Phil
Author_Institution :
Auburn Univ., AL, USA
Abstract :
Liquid crystal polymer (LCP) is a thermoplastic material with a variety of useful properties that can be exploited to yield new types of packaging for MEMS sensors. Although each type of MEMS sensor has unique packaging requirements, a commercial-off-the-shelf (COTS) MEMS humidity sensor, the Hygrometrix HMX2000 was selected as a representative MEMS sensor for packaging development. The packaging process consists of patterning and Sn coating the Cu cladding on the LCP substrate, followed by micromachining the LCP substrate to realize an environmental access port for the sensor. The sensor is then attached to the LCP substrate using AuSn intermetallic bonding on a flip chip bonder.
Keywords :
bonding processes; claddings; copper; electronics packaging; gold compounds; humidity sensors; liquid crystal polymers; micromachining; microsensors; tin; AuSn; Cu; Cu cladding; Hygrometrix HMX2000; LCP substrate; MEMS sensor packaging; Sn; Sn coating; commercial-off-the-shelf MEMS humidity sensor; flip chip bonder; intermetallic bonding; liquid crystal polymer; micromachining; patterning; thermoplastic material; Bonding; Coatings; Crystalline materials; Humidity; Liquid crystal polymers; Micromachining; Micromechanical devices; Packaging; Thermal sensors; Tin;
Conference_Titel :
Industrial Electronics Society, 2005. IECON 2005. 31st Annual Conference of IEEE
Print_ISBN :
0-7803-9252-3
DOI :
10.1109/IECON.2005.1569273
