• DocumentCode
    2918522
  • Title

    Sealing method of PDMS as elastic material for MEMS

  • Author

    Sawano, Satoshi ; Naka, Keisuke ; Werber, Armin ; Zappe, Hans ; Konishi, Satoshi

  • Author_Institution
    Ritsumeikan Univ., Ritsumeikan
  • fYear
    2008
  • fDate
    13-17 Jan. 2008
  • Firstpage
    419
  • Lastpage
    422
  • Abstract
    This paper proposes an effective sealing method of PDMS (polydimethylsiloxane) without losing elasticity of the material. Parylene (poly-para-xylylene) CVD can caulk porous PDMS structure and provide low permeable characteristics. The longstanding drawback is that parylene deposition on PDMS spoils elastic features of PDMS. MEMS devices using deformation of PDMS such as micro pump and micro balloon actuator requires not only high sealing but also high elasticity of PDMS. Deposited parylene permeates PDMS and then forms a film on PDMS. Our key idea is to remove a surface parylene layer on PDMS with the aim of keeping elastic features of PDMS. O2 plasma etching is applied to remove unnecessary surface parylene. This paper evaluates sealing and elastic features of parylene-caulked PDMS. Componential analysis of provided material by FTIR spectrum (FT-720, HORIBA Inc) is also reported. Parylene-caulked PDMS is applied to pneumatic balloon actuator devices, PDMS membrane-based micro-mirror device, in order to demonstrate advantages of proposed method.
  • Keywords
    Fourier transform spectra; chemical vapour deposition; elasticity; infrared spectra; micromechanical devices; plasma materials processing; polymers; sealing materials; sputter etching; CVD; FTIR spectrum; MEMS; O2 plasma etching; PDMS membrane-based micro-mirror device; elastic material; parylene-caulked PDMS; pneumatic balloon actuator devices; polydimethylsiloxane; sealing method; Actuators; Elasticity; Etching; Microelectromechanical devices; Micromechanical devices; Micropumps; Plasma applications; Plasma devices; Plasma materials processing; Sealing materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
  • Conference_Location
    Tucson, AZ
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-1792-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2008.4443682
  • Filename
    4443682