Title :
Batch fabrication of polymer microsystems with shape memory microactuators
Author :
Grund, T. ; Cuntz, T. ; Kohl, M.
Author_Institution :
IMT, Karlsruhe
Abstract :
This paper introduces the technologies of ultrasonic welding and heat-activated bonding for batch integration of micromachined polymer layers and shape memory alloy (SMA) foils or films. A series of ultrasonic welding tests is performed to achieve matter-free bonds on the wafer level with vertical accuracy of 1 mum. Heat-activated bonding is tested for various pressure and temperature conditions using micromachined foils of 60 mum thickness. The technologies are combined in a new process flow for batch fabrication of mechanically active polymer microsystems. The process flow is validated by the fabrication and characterization of SMA-actuated polymer microvalves.
Keywords :
bonding processes; microactuators; micromachining; polymer films; ultrasonic welding; valves; SMA films; batch fabrication; heat-activated bonding; micromachined polymer layers; polymer microsystems; polymer microvalves; process flow; shape memory alloy foils; shape memory micro actuators; size 60 mum; ultrasonic welding; Fabrication; Microactuators; Microvalves; Performance evaluation; Polymer films; Shape memory alloys; Temperature; Testing; Wafer bonding; Welding;
Conference_Titel :
Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
Conference_Location :
Tucson, AZ
Print_ISBN :
978-1-4244-1792-6
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2008.4443683