• DocumentCode
    2918600
  • Title

    Development of bi-axial tensile tester to investigate yield locus for aluminum film under multi-axial stresses

  • Author

    Nagai, Y. ; Namazu, T. ; Araki, N. ; Tomizawa, Y. ; Inoue, S.

  • Author_Institution
    Univ. of Hyogo, Himeji
  • fYear
    2008
  • fDate
    13-17 Jan. 2008
  • Firstpage
    443
  • Lastpage
    446
  • Abstract
    This paper describes novel biaxial tensile test technique for a film specimen to investigate material responses to uniaxial and biaxial tensile forces. We have developed biaxial tensile tester that consists of four sets of actuator, load cell, and displacement meter in order to apply an arbitrary amount of tensile force to a film specimen in each axis. With the uniaxial test specimen of sputtered Al film, average Young´s modulus of 35 GPa and yield strength of 115 MPa have been obtained. With the biaxial test specimen, evaluation of the yield locus for Al film has carried out by applying biaxial stresses with various strain rate ratios. The obtained yield stresses could be fitted by the yield criterion based on Logan-Hosford equation. This indicates that the flow stress under biaxial stress condition differ from that under uniaxial condition. Information about the yield locus would be useful for the structural design of MEMS including Al film structures subjected to biaxial stresses.
  • Keywords
    Young´s modulus; aluminium; metallic thin films; micromechanical devices; sputtering; stress analysis; tensile testing; Al; MEMS; Young´s modulus; aluminum film; biaxial tensile force; biaxial tensile tester; flow stress; multiaxial stress; multiaxial tensile force; sputtering; strain rate ratio; structural design; yield locus; yield strength; Actuators; Aluminum; Chromium; Materials testing; Micromechanical devices; Semiconductor films; Springs; Sputtering; System testing; Tensile stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
  • Conference_Location
    Tucson, AZ
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-1792-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2008.4443688
  • Filename
    4443688