Title :
Large displacement low voltage multistable micro actuator
Author :
Gerson, Y. ; Krylov, S. ; Ilic, B. ; Schreiber, D.
Author_Institution :
Tel Aviv Univ., Tel Aviv
Abstract :
This paper presents the modeling, design, fabrication and characterization of electrostatic large displacement multistable micro actuators. The device incorporates multiple serially connected bistable elements realized as shallow curved beams of slightly varying length. Loaded by an increasing force provided by an electrostatic comb drive transducer, the device undergoes a sequence of snap- through events and exhibits multiple stable equilibrium configurations at the same voltage. A reduced order (RO) model built using the Rayleigh-Ritz procedure as well as a nonlinear finite element (FE) analysis were used in order to predict the actuator behavior and evaluate design parameters. Devices of four different configurations were fabricated by a deep reactive ion etching (DRIE) based process using silicon on insulator (SOI) wafers. Experimental results demonstrate that the multistable devices exhibit stable displacement of 90mum while four snap-through and snap-back events take place during loading and unloading respectively. Experimental results are found to be in good agreement with the theoretical predictions.
Keywords :
Rayleigh-Ritz methods; electrostatic actuators; finite element analysis; reduced order systems; silicon-on-insulator; sputter etching; transducers; Rayleigh-Ritz procedure; SOI; Si-SiO2; deep reactive ion etching based process; electrostatic comb drive transducer; electrostatic large displacement; low voltage multistable micro actuator; multiple serially connected bistable elements; multiple stable equilibrium configurations; nonlinear finite element analysis; reduced order model; shallow curved beams; silicon-on-insulator wafers; snap- through events; Actuators; Electrostatics; Fabrication; Finite element methods; Low voltage; Microactuators; Predictive models; Semiconductor device modeling; Silicon on insulator technology; Transducers;
Conference_Titel :
Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
Conference_Location :
Tucson, AZ
Print_ISBN :
978-1-4244-1792-6
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2008.4443693