DocumentCode
2919058
Title
A systematic device qualification methodology for wafer fab process technology
Author
Rajah, Prakash ; Teck, Lim Wee
fYear
2010
fDate
11-14 April 2010
Firstpage
159
Lastpage
164
Abstract
To transfer a manufacturing process technology from one wafer fab to another fabrication plant is a complex exercise in today´s world of semiconductor. The fabrication of a semiconductor component, depending on the product type, requires a series of diffusion, photo-etch and metallization among other processes.
Keywords
MOS integrated circuits; etching; integrated circuit manufacture; MOSCAP product-technology transfer; manufacturing process technology; metal oxide semiconductor; metallization; photo-etch; product qualification; product type; semiconductor component; stringent electrical specifications; submicron wafer fabrication plant; systematic device qualification methodology; wafer fab process technology; wafer fabrication; Qualifications; MOSCAP; Receiving fab; Sending fab; Snakes & Bugs;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Devices, Systems and Applications (ICEDSA), 2010 Intl Conf on
Conference_Location
Kuala Lumpur
Print_ISBN
978-1-4244-6629-0
Type
conf
DOI
10.1109/ICEDSA.2010.5503083
Filename
5503083
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