An efficient technique for accurate modeling and simulation of substrate coupling in deep micron mixed-signal IC´s

Substrate noise in integrated circuits is a major impediment to mixed-signal integration. Accurate simulation is therefore, needed to investigate the generation, propagation, and impact of substrate noise. In this paper, we introduce novel substrate noise estimation and describe a fast and accurate simulator for modeling substrate coupling noise in mixed-signal RF IC design. Using a three-dimensional finite element method for extraction of substrate parasitic elements is developed.