• DocumentCode
    2919878
  • Title

    A Sealed-Bid Electronic Marketplace Bidding Auction Protocol by Using Ring Signature

  • Author

    Shi, Wenbo ; Jang, Injoo ; Yoo, Hyeong Seon

  • Author_Institution
    Sch. of Comput. Sci. & Eng., Inha Univ., Incheon, South Korea
  • fYear
    2009
  • fDate
    24-26 Nov. 2009
  • Firstpage
    1005
  • Lastpage
    1009
  • Abstract
    We modified the multi-agent negotiation test-bed auction scheme which was proposed by Collins et al. In 2004, Jaiswal et al. have modified Collins´s scheme, but Jaiswal´s scheme still has some security weaknesses: such as replay data attack and DOS (denial-of-service) attack, collision between customers and a certain supplier. So the proposed protocol tries to reduce DOS attack and avoid replay data attack by using improved ring signature scheme, also it achieves perfect anonymity. And it publishes an interpolating polynomial for sharing the determination process data and avoids collusion between a customer and a certain supplier. Furthermore, the proposed scheme relaxes the trust assumptions for three-party in Jaiswal´s scheme. According to comparison and analysis with other protocols, our proposed protocol shows good security.
  • Keywords
    digital signatures; electronic commerce; interpolation; multi-agent systems; polynomials; protocols; security of data; DOS attack; denial-of-service attack; determination process data; interpolating polynomial; multiagent negotiation test-bed auction scheme; replay data attack; ring signature; sealed-bid electronic marketplace bidding auction protocol; security protocol; security weaknesses; Computational efficiency; Computer crime; Computer science; Consumer electronics; Cryptography; Data security; Electronic equipment testing; Magnetic analysis; Polynomials; Protocols; E-auction; protocol;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Sciences and Convergence Information Technology, 2009. ICCIT '09. Fourth International Conference on
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-5244-6
  • Electronic_ISBN
    978-0-7695-3896-9
  • Type

    conf

  • DOI
    10.1109/ICCIT.2009.156
  • Filename
    5369569