DocumentCode
2920500
Title
A low cost sensing system for foot stress recovering on a Freeman platform
Author
Boukhenous, Samir ; Attari, Mokhtar
Author_Institution
Lab. of Instrum., USTHB, Algiers, Algeria
fYear
2011
fDate
11-14 Dec. 2011
Firstpage
276
Lastpage
280
Abstract
This paper highlights the design of a low cost sensing system for the study of foot reaction stress recovering. For instance, measurements are made on Freeman platform for ankle rehabilitation sessions. The system is based on the design of a sensing element and to set it onto a flexible material as a foot shape. The sensor element is based on a Hall Effect device coupled with a magnet in a typical elastic polymer material. The sensors are mounted on a printed circuit board and recovered with a hard polymer layer in order to obtain a uniform distribution of strains. The output signal of each sensing element is carried out to an instrumentation amplifier for adjusting the level of signals and settings. First calibration was performed for the study of the polymer material and then for the mounted sensor element in order to show the feasibility of such stress sensing. After calibration procedure, a dynamic measurement in real environment has been carried out with the instrument bonded onto a Freeman platform.
Keywords
Hall effect devices; biomechanics; biosensors; calibration; elasticity; instrumentation amplifiers; polymers; printed circuits; stress measurement; stress-strain relations; Freeman platform; Hall Effect device; ankle rehabilitation sessions; calibration; dynamic measurement; elastic polymer material; flexible material; foot reaction stress recovering; hard polymer layer; instrumentation amplifier; low cost sensing system; magnet; mounted sensor element; output signal; printed circuit board; Foot; Materials; Strain; Stress; Tactile sensors; Ankle rehabilitation; Foot reaction forces; Freeman platform; Hall device; Recovering; Stress measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics, Circuits and Systems (ICECS), 2011 18th IEEE International Conference on
Conference_Location
Beirut
Print_ISBN
978-1-4577-1845-8
Electronic_ISBN
978-1-4577-1844-1
Type
conf
DOI
10.1109/ICECS.2011.6122267
Filename
6122267
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