DocumentCode :
2921024
Title :
Fabrication of a fully integrated electrospray array with applications to space propulsion
Author :
Gassend, B. ; Velásquez-García, L.F. ; Akinwande, A.I. ; Martínez-Sánchez, M.
Author_Institution :
Massachusetts Inst. of Technol., Cambridge
fYear :
2008
fDate :
13-17 Jan. 2008
Firstpage :
976
Lastpage :
979
Abstract :
A fully integrated MEMS planar electrospray array intended for space propulsion applications is reported. An extractor electrode, electrical insulation, liquid barriers and assembly clips are integrated into a single silicon and Pyrex component, fabricated with deep reactive ion etching (DRIE), laser micromachining and wafer bonding technology. An electrospray emitter head assembles by hand to the clips using a reversible high-precision hand-assembly method, allowing many emitters types to be tested with minimal fabrication effort. Externally-wetted emitters were formed using an alternation of DRIE and isotropic SF6 plasma etching. A simple model is reported allowing the prediction of emitter geometry from mask geometry and etching steps. The fabricated thruster weighing 5 g was successfully fired with a 502 emitters array, and was shown to operate in the pure ion emission regime using the ionic liquid EMI-BF4. Starting voltages as low as 500 V were observed, though the device was tested up to 5 kV without damage.
Keywords :
aerospace propulsion; ion engines; micromachining; micromechanical devices; sprays; sputter etching; wafer bonding; DRIE; MEMS planar electrospray array; Pyrex component; assembly clips; deep reactive ion etching; electrical insulation; electrospray emitter; extractor electrode; fully integrated electrospray array; high-precision hand-assembly method; ion emission; isotropic SF6 plasma etching; laser micromachining; liquid barriers; mask geometry; mass 5 g; space propulsion; wafer bonding technology; Assembly; Dielectrics and electrical insulation; Electrodes; Etching; Fabrication; Geometry; Micromechanical devices; Propulsion; Space technology; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
Conference_Location :
Tucson, AZ
ISSN :
1084-6999
Print_ISBN :
978-1-4244-1792-6
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2008.4443821
Filename :
4443821
Link To Document :
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