• DocumentCode
    2921190
  • Title

    Low phase-noise UHF thin-film piezoelectric-on-substrate LBAR oscillators

  • Author

    Lavasani, H.M. ; Abdolvand, R. ; Ayazi, F.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta
  • fYear
    2008
  • fDate
    13-17 Jan. 2008
  • Firstpage
    1012
  • Lastpage
    1015
  • Abstract
    This paper reports on the first demonstration of a low phase-noise 467 MHz temperature-compensated oscillator based on a ZnO-on-nanocrystalline diamond lateral bulk acoustic resonator (LBAR). The temperature compensation is achieved by using a thin silicon-dioxide buffer layer on the surface of the diamond film. The oscillator performance is compared with an uncompensated 496 MHz AIN-on-silicon oscillator. The sustaining circuitry is comprised of a 9.4 mW tunable transimpedance amplifier (TIA) in 0.18 mum CMOS. The phase-noise is measured below -80dBc/Hz at 1kHz offset with temperature drift of < -4ppm/degC from -5degC to 90degC.
  • Keywords
    CMOS integrated circuits; UHF amplifiers; UHF oscillators; acoustic resonators; buffer layers; bulk acoustic wave devices; nanostructured materials; phase noise; piezoelectric devices; substrates; 0.18 mum CMOS; AIN-on-silicon oscillator; LBAR oscillator; UHF thin-film piezoelectric-on-substrate; ZnO-on-nanocrystalline diamond lateral bulk acoustic resonator; frequency 1 kHz; frequency 467 MHz; frequency 496 MHz; low phase-noise; power 9.4 mW; size 0.18 mum; temperature -5 degC to 90 degC; temperature compensation; thin silicon-dioxide buffer layer; tunable transimpedance amplifier; Frequency; Impedance; Micromechanical devices; Oscillators; Phase measurement; Piezoelectric films; Rough surfaces; Substrates; Temperature; Tunable circuits and devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on
  • Conference_Location
    Tucson, AZ
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-1792-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2008.4443830
  • Filename
    4443830