• DocumentCode
    292136
  • Title

    An alternative nondestructive experimental approach to tangential static field detection in SAW structures imaging

  • Author

    Chang, R.E. ; Richie, S.M. ; Casey, K.J. ; Malocha, D.C.

  • Volume
    1
  • fYear
    1994
  • fDate
    Oct. 31 1994-Nov. 3 1994
  • Firstpage
    341
  • Abstract
    The electrostatic electric field is the dominant excitation mechanism of the SAW interdigital transducer. A method to obtain measured interelectrode field strengths using the electro-optic effect in piezoelectric materials has been previously presented. This paper is an extension of the previous work in which the birefringence property and the linear electro-optic effect present in SAW substrates was utilized for obtaining images of the field distribution present in the interelectrode gap of a SAW IDT. An optical data acquisition system has been constructed capable of acquiring three dimensional profile data of the tangential field present in a SAW structure fabricated on a YZ-cut LiNbO3 wafer which has been polished on both sides. This technique is utilized for analysis of the predicted end effects at the end of the array of electrodes, and the end effects present in narrow aperture IDT transducers. Three dimensional simulations of the tangential field were carried out for simple structures by using the method of moments for the purpose of comparison between the experimental and theoretical results
  • Keywords
    birefringence; electric fields; electro-optical effects; interdigital transducers; method of moments; optical microscopy; surface acoustic wave transducers; LiNbO3; SAW IDT; SAW structures imaging; SAW substrates; YZ-cut LiNbO3 wafer; birefringence property; electrostatic electric field; end effects; field distribution imaging; interdigital transducer; interelectrode field strengths; interelectrode gap; linear electro-optic effect; method of moments; nondestructive method; optical data acquisition system; piezoelectric materials; tangential static field detection; three dimensional profile data; three dimensional simulations; Birefringence; Electric fields; Electrooptic materials/devices; Interdigital transducers; Microscopy; Moment methods; Optical imaging/mapping; Surface acoustic wave transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1994. Proceedings., 1994 IEEE
  • Conference_Location
    Cannes, France
  • Print_ISBN
    0-7803-2012-3
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1994.401606
  • Filename
    401606