Contact potential difference for sequential assembly and face alignment of submillimeter components

Author

Tanemura, T. ; Higuchi, Y. ; Kusakabe, T. ; Sugano, K. ; Tsuchiya, T. ; Tabata, O.

Author_Institution

Kyoto Univ., Kyoto

fYear

2008

fDate

13-17 Jan. 2008

Firstpage

1056

Lastpage

1059

Abstract

We demonstrated a new approach utilizing contact potential difference (CPD) based self-assembly for a future sequential assembly of nano/micro components and face alignment of submillimeter scale components. Two types of experiments realized by CPD were carried out; 1) sequential assembly of silica particles using Coulomb force induced by contacting a silver (Ag) probe on a platinum (Pt) substrate, and 2) face alignment of component with Ag on one face and Pt on the other face on a Pt substrate by CPD induced additional electrostatic adhesive energy. In the face alignment experiment, the measured adhesive energies of two different metal pairs (Pt-Ag and Pt-Pt) were one order smaller than the theoretical value. However, 83 % components were successfully aligned as Pt face up.

Keywords

adhesion; contact potential; electrostatics; microassembling; micromechanical devices; packaging; platinum; probes; self-assembly; silicon compounds; silver; submillimetre wave devices; CPD; Coulomb force; Pt; Pt-Ag; SiO₂; contact potential difference based self-assembly; electrostatic adhesive energy; face alignment; microcomponent sequential assembly; platinum substrate; silica particles; silver probe; submillimeter components; Electrostatics; Micromechanical devices; Packaging; Platinum; Robotic assembly; Self-assembly; Silicon compounds; Silver; Substrates; Virtual colonoscopy;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2008. MEMS 2008. IEEE 21st International Conference on

Conference_Location

Tucson, AZ

ISSN

1084-6999

Print_ISBN

978-1-4244-1792-6

Electronic_ISBN

1084-6999

Type

conf

DOI

10.1109/MEMSYS.2008.4443841

Filename

4443841