Title :
Large amplitude acoustoelectric interaction of surface acoustic waves in semiconductor-piezoelectric structure
fDate :
Oct. 31 1994-Nov. 3 1994
Abstract :
A quasi-static and quasi-one dimensional method of calculation of acoustoelectric interaction of surface acoustic waves (SAW) in layered semiconductor-piezoelectric structures is developed. The method is based upon conceptions of the electron and hole quasi-Fermi levels and the surface electric impedance. Both the concentration and trap mechanisms of nonlinearity are taken into account. This permits to obtain a nonlinear solution in not only the small signal approximation. The solution obtained is valid for finite and also large SAW amplitudes and takes into account surface semiconductor properties, such as surface band bending and surface states. According to the method, nonlinear SAW attenuation and dispersion, convolution transverse acoustoelectric voltage (TAV), acoustoelectric current and charge transport, and acoustoelectric bistability are calculated and analyzed. The theoretical results obtained are in agreement with experimental results
Keywords :
Fermi level; acoustic charge transport devices; acoustoelectric effects; electric impedance; nonlinear acoustics; piezoelectric thin films; semiconductor device models; surface acoustic wave signal processing; surface acoustic waves; surface states; acoustoelectric bistability; acoustoelectric current; charge transport; concentration mechanism; convolution transverse acoustoelectric voltage; dispersion; large amplitude acoustoelectric interaction; nonlinear SAW attenuation; nonlinear solution; quasi-Fermi levels; quasi-one dimensional method; quasi-static method; semiconductor-piezoelectric structure; small signal approximation; surface acoustic waves; surface band bending; surface electric impedance; surface states; trap mechanism; Impedance; Nonlinear acoustics; Piezoelectric films/devices; Semiconductor device modeling; Surface acoustic wave signal processing; Surface acoustic waves; Surfaces;
Conference_Titel :
Ultrasonics Symposium, 1994. Proceedings., 1994 IEEE
Conference_Location :
Cannes, France
Print_ISBN :
0-7803-2012-3
DOI :
10.1109/ULTSYM.1994.401626