• DocumentCode
    292169
  • Title

    Acoustic-wave based monolithic microsensors

  • Author

    Vellekoop, M.J. ; Lubking, G.W. ; Venema, A.

  • Volume
    1
  • fYear
    1994
  • fDate
    Oct. 31 1994-Nov. 3 1994
  • Firstpage
    565
  • Abstract
    Acoustic-wave based oscillators are used for several sensor applications. In addition to crystalline piezoelectric materials, silicon has gained interest as a substrate material for acoustic devices. Silicon implemented acoustic devices profit from the excellent properties of the silicon integrated circuit (IC) technology: high reliability, high reproducibility, small size and low cost. The monolithic integration of electronic circuitry and acoustic devices allows the development of highly-reliable small-size acoustic oscillators for sensor applications. In this paper the design and fabrication of monolithic Lamb wave oscillators is presented. In addition to bipolar IC-technology extra processing is required to obtain the Lamb wave oscillator system: thin film piezoelectric zinc oxide technology, and micromachining technology. The technologies used are completely IC-compatible which is an important feature for commercial production. The system forms the basis for several measurement instruments, e.g. liquid process-control equipment (control of composition of mixtures, determination of density and viscosity) and biosensors
  • Keywords
    integrated circuit technology; microsensors; surface acoustic wave oscillators; surface acoustic wave sensors; Lamb wave oscillators; Si; ZnO; acoustic-wave based oscillators; biosensors; bipolar IC-technology; electronic circuitry; liquid process-control equipment; measurement instruments; micromachining; monolithic microsensors; silicon substrate; thin film piezoelectric zinc oxide technology; Integrated circuit fabrication; Microsensors; Surface acoustic wave detectors; Surface acoustic wave device fabrication; Surface acoustic wave oscillators;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1994. Proceedings., 1994 IEEE
  • Conference_Location
    Cannes, France
  • Print_ISBN
    0-7803-2012-3
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1994.401652
  • Filename
    401652