DocumentCode :
2921769
Title :
Densely packed pie-shaped vertical cavity surface-emitting laser array incorporating a tapered one-dimensional wet oxidation
Author :
Young Gu Ju ; Lofgreen, D. ; Fiore, A. ; Syn-Yem Hu ; Hegblom, E. ; Louderback, D. ; Sjolund, O. ; Huntington, A. ; Coldren, L.A.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
fYear :
2000
fDate :
7-12 May 2000
Firstpage :
203
Abstract :
Summary form only given. Owing to their geometric advantage with respect to mass production, WDM VCSEL arrays have drawn attention as a low cost means of increasing data transmission rate for short haul communications. Recently, pie-shaped WDM VCSEL arrays were successfully fabricated by means of anodic etching followed by regrowth. In addition to this work, wavelength tuning of VCSEL emission has been demonstrated via postgrowth oxidation. In this paper, we present the results of applying postgrowth oxidation to the fabrication of mask-defined densely-packed WDM VCSEL arrays.
Keywords :
optical fabrication; optical transmitters; oxidation; semiconductor laser arrays; semiconductor lasers; semiconductor technology; surface emitting lasers; wavelength division multiplexing; WDM VCSEL arrays; anodic etching; data transmission rate; densely packed pie-shaped vertical cavity surface-emitting laser array; geometric advantage; mask-defined densely-packed WDM VCSEL array fabrication; mass production; pie-shaped WDM VCSEL arrays; postgrowth oxidation; short haul communications; tapered one-dimensional wet oxidation; wavelength tuning; Costs; Data communication; Etching; Fabrication; Laser tuning; Mass production; Oxidation; Surface emitting lasers; Vertical cavity surface emitting lasers; Wavelength division multiplexing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lasers and Electro-Optics, 2000. (CLEO 2000). Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
1-55752-634-6
Type :
conf
DOI :
10.1109/CLEO.2000.906914
Filename :
906914
Link To Document :
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