DocumentCode :
2921988
Title :
Foreword
fYear :
2008
fDate :
12-16 Oct. 2008
Abstract :
Presents the introductory welcome message from the conference proceedings.
Keywords :
Atmosphere; Circuits; High K dielectric materials; Maintenance; Meetings; Niobium compounds; Quality assurance; Robustness; Semiconductor device reliability; Titanium compounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2008. IRW 2008. IEEE International
Conference_Location :
S. Lake Tahoe, CA
ISSN :
1930-8841
Print_ISBN :
978-1-4244-2194-7
Type :
conf
DOI :
10.1109/IRWS.2008.4796070
Filename :
4796070
Link To Document :
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