Title :
Wire bonding of aluminum/polyimide multi-layer structures
Author :
Murali, V. ; Gasparek, M. ; Bhansali, A. ; Chen, S.H. ; Dias, R.
Author_Institution :
Intel Corp., Santa Clara, CA, USA
fDate :
March 31 1992-April 2 1992
Abstract :
Gold thermosonic wire bonding of aluminum pads located on thick polyimide films has been studied. Bond pull and bond shear studies indicated that the weld between the wire and pad was very poor, resulting in unacceptable failure strengths and failure modes. The incorporation of a thin Ti layer between the aluminum and polyimide was found to improve the weld quality and reliability dramatically. This improvement is attributed to the increased bond pad rigidity in the presence of Ti, which allows for a more efficient transfer of the ultrasonic energy to the wire/pad interface.<>
Keywords :
aluminium; failure analysis; gold; lead bonding; polymer films; reliability; shear strength; ultrasonic welding; Al-Ti; Al-polyimide multilayer structures; Au thermosonic wire bonding; Au-Al; US energy transfer; bond pad rigidity; bond pull; bond shear; failure modes; failure strengths; reliability; thick polyimide films; weld quality; wire pad weld; Adhesives; Aluminum; Bonding; Dielectrics; Gold; Polyimides; Sputter etching; Very large scale integration; Welding; Wire;
Conference_Titel :
Reliability Physics Symposium 1992. 30th Annual Proceedings., International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-0473-X
DOI :
10.1109/RELPHY.1992.187617
