DocumentCode
2922374
Title
General introduction to micromachining
Author
Banks, Danny
Author_Institution
Dept. of Mech. Eng., Surrey Univ., Guildford, UK
fYear
1997
fDate
35528
Firstpage
42370
Lastpage
42375
Abstract
This paper will introduce some basic micromachining technology. Photolithography, in different forms, is a key part of silicon, LIGA, and Excimer (ultraviolet) Laser micromachining. Some basic techniques and structures that can be produced by silicon micromachining will be discussed, as well as simple sensing and actuation methods. Diamond sawing and turning will be briefly mentioned, as well as problems associated with microdevice assembly and packaging
Keywords
micromachining; LIGA; Si; actuation; diamond sawing; diamond turning; microdevice assembly; micromachining; packaging; photolithography; sensing; silicon; ultraviolet excimer laser;
fLanguage
English
Publisher
iet
Conference_Titel
Microengineering Technologies and How to Exploit Them (Digest No: 1997/076), IEE Colloquium on
Conference_Location
Birmingham
Type
conf
DOI
10.1049/ic:19970427
Filename
640893
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