Title :
Accelerated 65nm Yield Ramp through Optimization of Inspection on Process-Design Sensitive Test Chips
Author :
Sang Chong ; Rying, E. ; Perry, Alison ; Lam, Stanley ; St. Lawrence, M.A.
Author_Institution :
IBM, Hopewell Junction
Abstract :
This paper describes an integrated methodology that combines short-flow test chips useful for exploring process-design systematic as well as random failure modes and an advanced inspection tool platform to characterize and monitor key Defects-of-Interest for accelerated defect-based yield learning at the 65 nm technology node. Utilization of a unique fast electrical testing scheme, rapid analysis software along with optimized inspection facilitated shorter learning cycles for accelerated process development. Knowledge derived from the CVreg- based inspection setup in a leading 300 mm fab was successfully transferred to manufacturing to facilitate inspection optimization for key Defects-of-Interest on product wafers.
Keywords :
electronic engineering computing; failure analysis; inspection; integrated circuit design; integrated circuit testing; integrated circuit yield; life testing; CV- based inspection setup; accelerated defect-based yield learning; accelerated process development; advanced inspection tool platform; defects-of-interest monitoring; integrated methodology; optimized inspection; process-design sensitive test chips; random failure modes; rapid analysis software; short-flow test chips; size 300 mm; size 65 nm; unique fast electrical testing scheme; yield ramp; Condition monitoring; Failure analysis; Image sensors; Inspection; Life estimation; Optical sensors; Optimization methods; Performance analysis; Semiconductor device testing; System testing; 2800; CV® Test chips; Characterization Vehicle®; Defect Inspection; Defect Overlay Analysis; KLA-Tencor; Process-Design interactions; S/N analysis;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference, 2007. ASMC 2007. IEEE/SEMI
Conference_Location :
Stresa
Print_ISBN :
1-4244-0652-8
Electronic_ISBN :
1-4244-0653-6
DOI :
10.1109/ASMC.2007.375083
